IC Leadframes Market Summary
IC Leadframes, or integrated circuit leadframes, are essential components in the packaging of semiconductor devices. They serve as a platform for mounting and electrically connecting an IC die (the actual silicon chip) to the external circuitry.
Function: The primary function of a leadframe is to provide a mechanical support structure for the IC die and to create an electrical path between the internal circuits of the chip and the external world, such as a printed circuit board (PCB). This connection is made through bonding wires that are attached from the die pads to the leads on the leadframe.
Structure: A typical leadframe consists of several parts:
Die Pad: The central area where the IC die is attached using adhesives.
Leads (or Pins): Metal strips extending from the die pad, which will eventually form the pins of the final packaged component. These leads are used to make the electrical connections.
Dam Bars (Tie Bars): Small metal bridges that connect the leads together during the manufacturing process, providing stability and preventing the leads from bending. These are typically removed before the final assembly.
Materials: Leadframes are commonly made from copper alloys, iron-nickel alloys (like Alloy 42), or other materials with good thermal and electrical conductivity. The choice of material can depend on factors such as cost, performance requirements, and compatibility with the IC and its intended application.
Figure. IC Leadframes Product Picture
IC and LED Leadframes
Source: Secondary Sources and QYResearch, 2024
According to the new market research report “Global IC Leadframes Market Report 2024-2030”, published by QYResearch, the global IC Leadframes market size is projected to reach USD 3.14 billion by 2030, at a CAGR of 4.2% during the forecast period.
Sumitomo Metal Mining Co., Ltd. (SMM) has withdrawn from the Leadframe business, based on an assessment of the changing business environment. The Leadframe market itself has gone from a growth market to the mature phase, resulting in over-commoditization of Leadframe products. Moreover, the emergence of Chinese local manufacturers has intensified competition for these products. On March 17, 2017, Chang Wah Technology purchased SH Asia Pacific Pte. Ltd., a Singapore-based investment company, from SH Materials Co., Ltd. (SHM). In 2017, Jin Lin Technology has merger and acquisition three power device lead manufacturer from Japan Sumitomo Metals (SMM), which are SH Precision Co., Ltd (Japan), Suzhou SH Precision Co., Ltd (China) and Malaysian SH Precision Sdn Bhd (Malaysia). Nowadays, Jih Lin Technology is status as the top power devices Leadframe manufacturer of the world. On 28 July 2020, ASM Pacific Technology, together with Wise Road Capital LTD and Asia-IO Capital Management Limited, announced the formation of a Strategic Joint Venture (“SJV”) for ASM Pacific Technology’s Materials Segment Business Unit, which produces Leadframes.
At present, the major companies focus on China Taiwan, Japan, Korea, Southeast Asia and China. Of the major manufactures, Mitsui High-tec, HAESUNG DS, Advanced Assembly Materials International, SDI and Chang Wah Technology captured the global top five suppliers. In 2023, Mitsui High-tec obtained the global first largest position, occupied 12.66% global revenue market share, followed by HAESUNG DS, Advanced Assembly Materials International, SDI and Chang Wah Technology with 10.31%, 10.22%, 9.56% and 8.81% global revenue market share, respectively.
There are two technology classification of IC Leadframe in this report: stamping process Leadframe, etching process Leadframe. The Stamping Process Lead Frame segment was estimated to account for the highest sales volume share of 64% in 2024. However, Etching Process Lead Frame is expected to grow at a higher growth rate in the next few years, because Etching Process Lead Frame can etch more leads and smaller lead pitch, so that the packaged chip will be thinner and smaller. The Etching process Leadframe makes the electroplating block technology more refined and more flexible.
Figure. Global IC Leadframes Market Size (US$ Million), 2019-2030
IC and LED Leadframes
Above data is based on report from QYResearch: Global IC Leadframes Market Report 2024-2030 (published in 2024). If you need the latest data, plaese contact QYResearch.
Figure. Global IC Leadframes Top 17 Players Ranking and Market Share (Ranking is based on the revenue of 2023, continually updated)
IC and LED Leadframes
Above data is based on report from QYResearch: Global IC Leadframes Market Report 2024-2030 (published in 2024). If you need the latest data, plaese contact QYResearch.
According to QYResearch Top Players Research Center, the global key manufacturers of IC Leadframes include Mitsui High-tec, HAESUNG DS, Advanced Assembly Materials International, SDI, Chang Wah Technology, Shinko, Kangqiang, Fusheng Electronics, POSSEHL, Enomoto, etc. In 2023, the global top 10 players had a share approximately 71.0% in terms of revenue.
Figure. IC Leadframes, Global Market Size, Split by Product Segment
IC and LED Leadframes
Based on or includes research from QYResearch: Global IC Leadframes Market Report 2024-2030.
In terms of product type, currently Stamping Process Leadframe is the largest segment, hold a share of 64.0%.
Figure. IC Leadframes, Global Market Size, Split by Application SegmentIC and LED Leadframes
Based on or includes research from QYResearch: Global IC Leadframes Market Report 2024-2030.
In terms of product application, currently OSAT is the largest segment, hold a share of 79.8%.
Figure. IC Leadframes, Global Market Size, Split by Region
IC and LED Leadframes
Based on or includes research from QYResearch: Global IC Leadframes Market Report 2024-2030.

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